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7Layers invited to Telit DevCon

Published on 24 August 2012

Telit welcomes five M2M leaders as gold sponsors for second annual developer’s conference

7Layers, Digi International, Direct Communications Solutions, Spectrum and Taoglas to Join Connected Device Developers at Telit DevCon 2012 in San Diego

Raleigh, NC – August 23, 2012 –Telit Wireless Solutions, Inc., a leading global provider of high-quality machine-to-machine (M2M) modules and services, announced today that 7Layers, Digi International®, Direct Communications Solutions (DCS), Spectrum Design Solutions and Taoglas will participate as gold sponsors in Telit DevCon 2012, the second annual M2M developers conference taking place on October 8 in San Diego, California.

Joining platinum sponsor Intel, these leading companies represent the broad range of participants who will come together for this one-day forum centered on cellular device development. Building on the success of last year’s event, Telit DevCon 2012 will again play a vital role in connecting application engineers, business leaders, industry analysts and technology experts, offering invaluable guidance forsuccessful M2M deployments in a highly segmented market.

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